Organization that defines and develop standards:

IPC:

IPC (Institute for Interconnecting and Packaging Electronic Circuits) is the Association Connecting Electronics Industries. Its aim is to standardize the assembly and production requirements of electronic equipment and assemblies to highlight the expansion from bare boards to packaging and electronic assemblies.

SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including Microsystems, emerging technologies, and related business operations.

Jedec:

This standard applies to the board/assemblies, to identify the type of Pb-free or Pb-containing solder used. This standard documents a method for the identifying board surface finishes and Printed Circuit Board (PCB) resin systems.This standard applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).

EIA:

EIA (Electronic Industries Alliance) is a standards and trade organization composed as an alliance of trade associations for electronics manufacturers in the United States. They developed standards to ensure the equipment of different manufacturers was compatible and interchangeable.

ANSI:

ANSI (American National Standards Institute) is a private non-profit organization that oversees the development of voluntary consensus standards for products, services, processes, systems, and personnel in the United States.

IEEE:

ASME (American Society of Mechanical Engineers)is a professional association which "promotes the art, science, and practice of multidisciplinary engineering and allied sciences around the globe" via "continuing education, training and professional development, codes and standards, research, conferences and publications, government relations, and other forms of outreach.